Bonding/LACP on Switch Chip?

I am pretty sure it isn’t possible, but I was curious if there was something I didn’t know. If not is it going to be added at some point? Without a switch chip capable of doing Bonding/LACP it seems pointless on Gigabit interfaces since there is no was the 600 Mhz CPU on the CRS, etc could actually handle bonding the interfaces together.

Thoughts?

-Eric