I have a CCR2004-16G-2S+PC version’s technical inquiry.
Incluse users who are using CCR2004-16G-2S+PC, please reply.
Please will uploading a captured image. - /system health print
I have a CCR1009-7G-1C-1S+PC and 6 May purchased CCR2004-16G-2S+PC
CCR1009 is about 57’C in full load but not more than heat CCR2004.
CCR2004 full load 82’C, Idle 67’C
Will there be any problems in use?
I think CCR2004’s CPU temperature is some high.
CCR2004 is high CPU temperature, but the heatsink is not high warm.
May it seems an assembly problem, such as a heatsink installation problem or a thermal grease problem?
(ex/ Heat sink and CPU is not stick close)
I’m a little worried because I asked a technical inquiry about the heat problem of the CCR1009 of a similar form factor in the 2018 year.
The CCR1009, I use now has no issues and was new purchased at last year. (Exchange from CCR1036)
Fortunately, CCR2004 is good working yet just only have high temperature.
If it have a system issue, it must be replaced within about 2 weeks from the seller.
But when RMA unfortunately, I will may pay return cost, so need an exact answer please.
It’s actually better to use a high quality thermal paste than pads. (Be it silver or ceramic based, would not recommend any of the liquid metal products for use in a router as there can possibly be issues with reactions with the metals)
Pads are normally used when there is a bit of a gap between the heat sink and the component to be cooled (often used on ram chips to help cool them as they don’t normally generate excessive heat). Pads also have a lower heat transfer ability.
The alternative to pads if you want there are thermal sheet products that are reusable, but I wouldn’t recommend them mostly for their cost, and a high quality paste is usually more effective.
You are probably right - currently we are using thermal pads and temps are 44board and 57Ccpu on idle - again a bigger improvement than 77C and 103C on idle
When I first exracted the heatsink, the thermal pad was not attached and the thermal paste was hardened.
I think, The thermal paste application seems to be correct and I used MX-4.