Add the bonding interface to the bridge is not the problem. But until the ether interfaces are not be able to add, the whole config is not related to HW-offload, which is the goal for the expected configuration. Many thanks for the hint.
I’m not sure if this is right. Because the documentation on the Wiki says I have to add the ether interfaces to bridge also to user HW-offload. When I add the bond interface only, the “H” tag is missing and then it looks that the bonding interface is handled by the CPU instead of the hardware.
Today I have tried to add a device to the bonding interface. It does not work unfortunately. So I think LACP is currently no useable feature on CRS326. Hopefully a fix would be available soon.
That isn’t a blank config. That’s a factory config. I can’t remember exactly but on a CRS125 ether1 was WAN and ether2-24 were switched with ether2 as a master.
Try completely resetting the switch ensuring you tick “no factory defaults” (or similar) and then configure from scratch, bonding is refreshingly easy with MikroTik.