Hi
I’m very new to MT.
Q: I’ve seen bonding for RJ45 interfaces but does LACP (bonding) also work for instance on CRS326-24G-2S+IN for the two SFP+ interfaces?
Thx ara
A: It should. Strictly speaking LACP does not depend on type of physical layer (copper vs. FO), it depends on data link layer (L2) which is ethernet in both cases.
From our South African colleague, recently emigrated to the UK, and soon will be a wanker!!