RB3011 LACP Bond using Switch Chip

Hi folks,

I’ve succesfully implented my RB3011 with a couple of VLANs using the switch chips with hardware offloading.
Works quite nice and I have wirespeed performance. Now I want to use a bond of two 1GBit/s interfaces using
LACP to connect to my coreswitch. How should that be done? Is it possible?

Until now, I get bonds only working using a bridge and everything is handled in software.

What I’ve also tested:
Configure the Switch chips using /interface switch (port/vlan) and create a bond using /bridge bond - but that doesn’t work.

Any thoughts?

Kind regards
Richard

Hi,

As I know is only possible to achieve bonding hardware offloading on the new CRS3xx devices.

https://wiki.mikrotik.com/wiki/Manual:CRS3xx_series_switches#Bonding

From the wiki page:
Since RouterOS v6.42 all CRS3xx series switches support hardware offloading with bonding interfaces. Only 802.3ad and balance-xor bonding modes are hardware offloaded, other bonding modes will use the CPU’s resources. You can find more information about the bonding interfaces in the Bonding Interface section. If 802.3ad mode is used, then LACP (Link Aggregation Control Protocol) is supported.

To create a hardware offloaded bonding interface, you must create a bonding interface with a supported bonding mode

You can also check the list/table of the supported devices and features per device/switchchip in the below link.

https://wiki.mikrotik.com/wiki/Manual:Interface/Bridge#Bridge_Hardware_Offloading

Best regards,
Andrej