I have (2) CRS520-4XS-16XQ-RM switches connected together via a LACP bond using 10GB DACs in the SFP ports. The bond works appears to be working fine, however, the Tx Fault checkbox is always checked for the interfaces on the second connection of the bond. This happens even if I move the second connection to different ports. Changing the DAC cables did not change it either.
Both connections seem to be working so this may just be a bug, but I want to be sure.
