WARNING CRS310-8G - quality by issue with heatsink inside (loose?)

Warning - your CRS310-8G+2S+IN unit might have a loose heatsink inside!

Just received my CRS310 and was annoyed by the cooling fan noise. Looking into the cause of this i found a youtube video discussing the move the swOS and a cooling fan replacement where i noticed 1 heatsink being on the side which is kind of weird.

Link to the video: https://www.youtube.com/watch?v=Ow2u__L-1Cc

When opening up my CRS310 i found horror. The heatsink was sitting on top of a capacitor and the adhesive pad was sitting next to one of the chips ..not good as the heatsink might have been traveling inside and damaged some electronics? Needless to say that i am going to have my unit replaced.

@Mikrotik - you need to have all your units checked. The youtube video seems to made in the USA, i am based in the Netherlands.
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in this case, what adhesive you use? replace the current adhesive?

Usually you just get a replacement thermal pad, if you cannot find one of the exact size you can buy a larger one and cut it yourself to measure.
Specific thermal epoxy glues do exist, but if the original was setup with a thermal pad, in first instance it is better to replace it with a simillar one (applying the epoxy glue is not so simple).

Normally i would not be afraid to apply a new thermal pad - i’ve around long enough to even use a soldering iron on a pc mainboard.. but in this case the added complexity is that the existing pad seems to have landed op top of some ic’s next to where it should be. Removal thereof is likely to cause damage to the pcb components so i am not touching that.

Besides: this is clearly a production problem - therefore a warranty case.

It should be checked, if under the thermal pad there is another chip, and from the white L shaped marks it seems like the heatsink should have gone over TWO chips, the one where the thermal pad still is and the other one without thermal pad, it would make little sense to place the heatsink in a so much “off-center” position and the size/shape of the remaining thermal pad is clearly not suitable for the larger chip.

Compare with the photo here:
https://www.servethehome.com/wp-content/uploads/2023/11/MikroTik-CRS310-8G-2S-IN-Internal-Overview-1.jpg

Hypothesis:
There should be two thermal pads, one for each chip, but in production the larger one has been forgotten.
Thus the heatsink has been glued only on a very limited and off-center surface and detached itself.