Right now I have a RouterBOARD 3011UiAS, which has worked awesome.
It however doesn’t have the 1+Gbps capabilities I want to have for the future.
I want to be able to bond two or more WAN ports from a cable modem (2 to 4 max) to get the over 1Gbps speed offered on comcast now, they max out at 1240Mbps so 2 ports bonded right now would work). When I do LACP bonding right now on my current one the speed slows down to about 300Mbps, unbond them and I get 900Mbps.. so I am guessing there is hardware limitation there.
My goal would be to have a bond from my router to the switch or use a 10G SFP+ connection between the two, then have a bonded copper port connection to the cable model.
I was looking at a CCR1009-7G-1C-1S+, but not sure if that is enough, too much, etc..
what would you recommend? or am I doing something wrong on my 3011UiAS?
If I bond two copper 1Gbps ports on that model would it use hardware offloading or would it all be done at the software / CPU level? I’m kind of thinking that’s why I see a big drop when bonding now is I am not getting the hardware acceleration, nor am I sure how to verify that I am or am not on the bond
I also have multiple VLAN’s it appears (maybe I am wrong) but this model’s chipset doesn’t support VLAN’s at the hardware level so it will offload to the CPU for handling?
Ports 1 and 2, I assumed you want to bond on the same switch chip, maybe that's not the case? Not sure I read the block diagrams right, there is only 1Gbps per switch chip back to the CPU, so to get 2Gbps (max theoretical) I would have to be on two switch chips or on just one? or should I bond on one switch chip and put the LAN on another?
AFAIK bonding is done in software (except for CRS3xx), so all the traffic will pass the switch chip - CPU interconnection. RB4011 features a 2.5Gbps interconnection link, so theoretically it should be possible to exceed 1Gbps over a bond regardless which ports are in bond (but traffic will fight with the rest of traffic, e.g. LAN-CPU traffic). If both links are using same switch chip, the will almost saturate the interconnection though.
The problem is even bigger on RB3011 with its dual-1Gbps interconnects (one per CPU core) … I highly doubt a single bond scales nicely over both CPU cores, only Buddha knows how’s interconnection between both cores. In case of RB3011 bonding ports from both switch chips might help … if traffic from those ports really get routed to the same CPU core … and, again, only Buddha knows how switch chips determine which CPU connection to use for delivery of particular packet … I guess the chances for that are fair given use of some advanced features of Qualcomm switch chips in ROS.